HB TECHNOS CORP : 에치비테크노스 (주)

설비명 : LDI 장치 / Exposing M/C / Dry Film & Solder Mask

제작사 : Limata Gmbh / Germany / www.limata.com

대응 자재 : Sheet (Rigid & Flexible), Roll to Roll (Flexible)

최대 사이즈 (Sheet) : 2,438mm x 1,220mm (96" x 48")

▶ Adressable PCB applications with LIMATA`s Laser direct imaging

• 내외층 이미징 - 표준 & LDI dry films / 다파장 사용

• 내외층 이미징 - 표준 & LDI solder masks / 다파장 사용 / 광원 : UV Laser + IR Laser 사용

Machine Concept

PCB's Applications

Exposing Laser (LDI) / Dry Film & Solder Mask (Optional : IR Laser)

UV Laser Beam

IR Laser Beam

UV + IR Laser Shooting UV Laser +IR Laser Beam & Scanning Exposing Laser Source

LDI + Automation / 자동화

Single system X2500DF with automation Twin-set inline system X2500SM with automation

Through put / 생산성

Model : X2500 DF / Dry Film / 단차대응 / Depth of focus : +/- 500µm

▶Through put : 시간당 300매 (Single Automation) / 시간당 600매 (Twin Automation)

  Energy : 20-30mJ/㎠ @ 75um line / space
   Board Size : 610mm x 460mm (24“ x 18“, 노광 erea 기준)
   Vision Align : 4 point registration 기준

Automation : loading & un-loading

Model : X2500 SM / Solder Mask / 단차대응 / Depth of focus : +/- 500µm

▶Through put : 시간당 65～60매 (Single Automation) / 시간당 130～120매 (Twin Automation)

Ink : Taiyo PSR-4000 Green

   Energy : 400-600mJ/㎠ / Silk Screen Version / DF Solder Mask 대응
   Board Size : 610mm x 460mm (24“ x 18“, 노광 erea 기준)
   Vision Align : 4 point registration 기준

Automation : loading & un-loading

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